Factory Price Graphite Sintering Mold for Electronic Packaging

Product Details
Customization: Available
Application: Metallurgical Industry, Semiconductor Industry
Carbon Content: High-Carbon
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Registered Capital
500000 RMB
Plant Area
>2000 square meters
  • Factory Price Graphite Sintering Mold for Electronic Packaging
  • Factory Price Graphite Sintering Mold for Electronic Packaging
  • Factory Price Graphite Sintering Mold for Electronic Packaging
  • Factory Price Graphite Sintering Mold for Electronic Packaging
  • Factory Price Graphite Sintering Mold for Electronic Packaging
  • Factory Price Graphite Sintering Mold for Electronic Packaging
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Basic Info.

Model NO.
CZKBSE042
Composition
Carbon
Crystal Morphology
Layer Crystal Structure
Forming Way
Isostatic Graphite
Grade
Industrial Grade
Type
Specialty Graphite Or Special Graphite
Bulk Density (G/Cm³ )
1.85-1.9g/cm3
Materials
Purified Graphite
Size and Shape
Customer Request
Color
Black Grey
Advantages
Corrosion Resistance
Place of Origin
Hebei, China
Ash
20 Ppm
Transport Package
Plywood Box
Specification
customized
Trademark
KB
Origin
China
Production Capacity
800000 Pieces/Month

Product Description

Semiconductor 
Factory Price Graphite Sintering Mold for Electronic Packaging
A substance that conducts electricity is called a conductor, and a substance that does not conduct electricity is called an insulator. Semiconductors are substances with properties somewhere between them.

Semiconductor devices are installed in systems such as smartphones, computers, automobiles, and home appliances that are essential to our daily lives. Components made from specialty graphite are essential to many processes in semiconductor production.

Graphite for Semiconductor 

In the semiconductor industry, graphite materials are widely used due to their excellent properties such as electrical and thermal conductivity, corrosion resistance, mechanical processing performance, and self-lubrication. Graphite products can not only improve production efficiency and product quality, but also ensure the high reliability and high performance of semiconductor devices.


Applications of graphite in semiconductor industry 

Many semiconductors are made of silicon. This metalloid is grown into single crystals, sliced into thin wafers and, finally, processed into tiny micro-electric systems. 
Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging


Graphite can be applies to the crystal growing or the subsequent finishing with epitaxy or ion implantation. These processes take place at very high temperatures and in extremely corrosive environments. At the same time, highest purity and absolute precision are required.

1. Graphite Parts for Simiconductor Crystal Growth

Graphite products for crystal growing hot zones, include graphite heaters, support crucibles, heat shields and insulating components. 
 
The single crystal furnace is a flexible shaft lifting equipment used for growing single crystals using the Czochralski (CZ) method. The CZ method relies heavily on high purity graphite parts and graphite felt insulation. Many components in hot zone of single crystal furnace is made of high purity graphite. 
Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging
2. Graphite Susceptors and Graphite Compoents for Silicon and Sic Epitaxy 

Graphite can also be used as high-precision graphite components for wafer processing equipment like SiC-coated graphite susceptors. We produce graphite susceptors and graphite components for all current epitaxy reactors. 

Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging


3.  Graphite components for ion implantation

Ion implantation is a complex and sensitive process and is used in the manufacture of semiconductors. During the implantation process, dopant ions are accelerated and implanted into a monocrystalline silicon substrate to manipulate its bulk properties. Boron, phosphorous and germanium are some of the typical dopant materials.Implanter systems dope wafers with foreign atoms to modify material properties such as conductivity or crystal structure. The beam path is the center of an implanter system. Here the ions are generated, concentrated, greatly accelerated, and focused on the wafer at very high speeds.


Factory Price Graphite Sintering Mold for Electronic PackagingIdeal product properties
Temperatures up to 1400°C, strong electro-magnetic fields, aggressive process gases, and high mechanical forces are a problem for regular materials. Not so with our products. Our heat resistant components made from graphite offer the ideal combination of corrosion resistance, material strength, good thermal conductivity, and absolute purity. They ensure that the ions are generated efficiently and are focused precisely on the wafer in the beam path without any impurities. Our components and spare parts made from graphite help to ensure that this process is as efficient, precise, and free of impurities as possible.
Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging
 
Factory Price Graphite Sintering Mold for Electronic Packaging
Ion Implantation Components Key Features:
Material Compatibility: Ion implantation components are crafted from materials with high purity, excellent thermal conductivity, and resistance to harsh environments.
Precision Design: Components are meticulously engineered to ensure accurate beam alignment, uniform dose distribution, and minimal scattering effects.
Wear Resistance: Ion implantation components are coated or treated to enhance wear resistance and minimize particle generation, prolonging their operational lifespan.
Temperature Control: Efficient heat dissipation methods are integrated to maintain temperature stability during ion implantation processes, ensuring consistent results.
Customization: Ion implantation components are designed to match specific equipment
 
Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging
4.  Graphite molds for electronic packaing and sintering
Factory Price Graphite Sintering Mold for Electronic Packaging
Graphite mold for sintering and packaging electronic products is designed specifically for the packaging and sintering process of semiconductors and electronic products. In semiconductor packaging technology, graphite molds are used to carry and fix semiconductor chips, ensuring that the chips can stably bond with other components during the sintering process at high temperatures and specific atmosphere, achieving the packaging purpose.
 
 
Features:

1. Excellent thermal conductivity: Graphite has extremely high thermal conductivity, which can quickly transfer heat to the mold surface, helping to ensure uniform heating of the product during sintering and improve product quality.

2. Good chemical stability: Graphite can resist the erosion of various chemicals, ensuring stable performance in complex packaging environments.

3. Strong wear resistance: Graphite has high hardness and good wear resistance, and can withstand long time and frequent sintering operations, extending their service life.

4. Good processing performance: Graphite are easy to be machined, and can be customized in different shapes and sizes according to different packaging requirements.

 
Factory Price Graphite Sintering Mold for Electronic Packaging

Technical Data of Graphite Material: 
Isostatic Graphite
Property KBD-5 KBD-6 KBD-7 KBD-7B KBD-8 Unit
Apparent Density 1.85 1.90 1.82 1.82 1.90 g/cm3
Max Grain Size 13-15 8-10 8-10 13-15 8-10 µm
Ash value ≤500 ≤500 ≤500 ≤500 ≤500 ppm
Specific Electrical Resistivity 8-10 8-9 11-13 11-13 11-13 μΩm
Flexural Strength 46 55 51 59 60 Mpa
Compressive Strength 85 95 115 121 135 Mpa
Shore Hardness 48 53 65 70 70 HSD
Thermal Expansion (room temperature to 600ºC) 4.75 4.8 5.8 5.8 5.85 10-6/ºC
Molded Graphite 
Property KBG-4 KBG-5 Unit
Apparent Density  ≥1.80 ≥1.85 g/cm3
Ash value  ≤500 ≤500 ppm
Shore Hardness ≥40 ≥45 HSD
Specific Electrical Resistivity  ≤12 ≤12 μΩm
Flexural Strength  38 41 Mpa
Compressive Strength 81 87 Mpa
Max Grain Size 25 25 μm

Vibration Graphite
Property TSK GSK Unit
Apparent Density 1.70 1.72 g/cm3
Max Grain Size 2 0.8 mm
Specific Electrical Resistivity 8-10 8.5 μΩm
Flexural Strength  12.5 15 Mpa
Compressive Strength 28 35 Mpa
Porosity 24 20 %
Ash value 0.3 0.3 %

ASH can be purified into 50 ppm, 20 ppm or lower. 

Factory Price Graphite Sintering Mold for Electronic Packaging
Advanced Production Equipments 
Factory Price Graphite Sintering Mold for Electronic PackagingFactory Price Graphite Sintering Mold for Electronic Packaging

Strict Quality Control Ensures High Quality Products

  
Factory Price Graphite Sintering Mold for Electronic Packaging
Safe Packing 
Factory Price Graphite Sintering Mold for Electronic Packaging
Factory Price Graphite Sintering Mold for Electronic Packaging
Question and Answer:


Q:Are you a manufacturer or trading company?
A:We are a manufacture for graphite material and graphite machined products.

Q:How can you gurantee the quality?
A:We have the most advanced equipments in our lab and professional quality control team.We can gurantee each batch of the product with the stable quality.

Q:Can you offer samples?
A: Yes, we offer samples to test

Q: Delivery time?
A:Around 10 days.


Q: Shipping port
A: Tianjin or main port in China

Q:Payment terms
A:T/T,LC at sight


 

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